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Technical Specifications

Complete technical reference.

Every specification you need to evaluate, procure, and integrate the Patient-Matched Skull Reconstruction System. For deeper technical content, see ME-Fab® platform and standards compliance.

Product Identification

Identification & configuration.

ItemDetail
Product nameAdditive Manufacturing Patient-Matched Skull Reconstruction System
ModelsDLZ04 · DLZ05
Size range30 – 200 mm
IndicationsCranial defect repair & reconstruction
Patient typeAdult & paediatric (size-dependent)
CustomisationPatient-matched from CT/MRI DICOM
UsageSingle patient, single use
ClassClass III implantable
ItemDetail
Registration cert.国械注准 20263130176
Cert. holderShenzhen Excellent Technology Co., Ltd.
ManufacturerShenzhen Excellent Technology Co., Ltd.
Manufacturer site10B Kechuang Building, Quanzhi Tech Park, Bao'an, Shenzhen
UDI carrierHuman- and machine-readable per MDR Annex VI / 21 CFR 801
Basic UDI-DICRANIO-PSI-3D-PEKK-FAM (proposed per MDR)
GMDN / EMDN61439 / EMDN P04029901
Lead time5–7 working days · 3 days expedited
Material & Biological

Medical-grade Ti-6Al-4V ELI.

ItemSpecificationStandard
PowderTi-6Al-4V ELI, gas-atomised, sphericalASTM F136, ASTM F3301 (powder)
Particle size distribution45 – 105 µmASTM B214, ISO 13322-1
Oxygen in finished part< 2,000 ppmASTM F136 / ISO 5832-3
Surface roughness (post-EBM)Ra 5 – 15 µm (as-built)ISO 4287/4288
ELI specificationO ≤ 0.13% · N ≤ 0.03% · Fe ≤ 0.25% · H ≤ 0.0125%ASTM F136 / ISO 5832-3
Screw materialTC4 titanium (Ti-6Al-4V)GB/T 13810
Post-processingStress relief (730 °C / 2 h / vacuum) or HIP (900–950 °C / 100 MPa / 4 h / Ar)ASTM F3301
Final cleaningUltrasonic + nitric acid passivationASTM F86
BiocompatibilityFull ISO 10993 panelISO 10993-1 to -22
Surface chemistryNative TiO₂ · Ti-OH groups for protein adsorption
Manufacturing & Micro-Architecture

EBM parameters and the gradient porous structure.

EBM ParameterValue
Vacuum< 1 × 10⁻³ mbar
Beam voltage60 kV
Beam current3 – 30 mA (function-graded)
Scan speedup to ~10⁴ mm/s
Layer thickness50 – 100 µm (default 70 µm)
Pre-heat700 °C
Oxygen in chamber< 50 ppm
Powder reuse limit≤ 20 cycles
Micro-Architecture ParameterValue
Porosity (bone-contact)60 – 80%
Porosity (load-bearing)20 – 40%
Pore size300 – 800 µm (Bobyn window)
Strut thickness200 – 500 µm
Interconnectivity window≥ 100 µm (Klawitter-Hulbert threshold)
Density (after HIP)≥ 99.5%
Surface treatmentPassivation ASTM F86
Surface structureBiomimetic dual-surface (porous / smooth)
Mechanical Performance

Lab data and acceptance criteria.

Test Method / Standard Our result Industry benchmark
Quasi-static compressive failureASTM F3821,400 N peakMesh ≈ 40 N
Impact deformationInternal drop rig< 0.7 mm, full elastic recoveryMesh > 7 mm permanent indent
Fatigue (5 Hz, R = 0.1, 37 °C SBF)ASTM F382 / ISO 14801≥ 5 × 10⁶ cyclesMesh < 10⁶; PEEK < 5×10⁵
Tensile strength (finished)ASTM E8≥ 860 MPa UTS, ≥ 795 MPa YSWrought ELI ≥ 860 MPa
ElongationASTM E8≥ 10%ELI spec ≥ 10%
FEA — peak von MisesPatient-specific< 440 MPa
FEA — interfacial micromotionPilliar threshold< 50 µm
FEA — stress-shielding ratioImplant ÷ bone strain0.7 – 1.3
Sterilisation & Packaging

Validated to international standards.

Process StepSpecificationStandard
Part removalWire EDMInternal SOP
Surface finishingCNC trimming, drill/tap interfacesInternal SOP
PassivationNitric acidASTM F86
CleaningMulti-stage ultrasonic + DI rinseInternal SOP
Inspection100% CMM dimensional check vs. design STLISO 10360
ConformityCT scan of finished part vs. design STLInternal SOP
LabellingUDI carrier (human + machine)MDR Annex VI; 21 CFR 801
Process StepSpecificationStandard
SterilisationEO (default) or gammaISO 11135 / 11137
PackagingDouble-pouch + Tyvek, ISO Class 7 cleanroomISO 11607-1/-2
Shelf life5 years from sterilisationValidated by accelerated aging
StorageDry, room temperature, protect from lightIFU
TransportValidated ISTA 3A distribution cycleISTA 3A
Lead time5–7 working days · 3 days expedited
Spare implant±10% size backup shipped together